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Pattern Transfer Printing (PTP)

Product Introduction

This system fills conductive paste into specially designed micro-grooves on a polymer film. A high-power laser beam is then used to align and scan, transferring the paste precisely onto the cell surface to form metallic gridlines. The process enables non-contact, pressure-free printing with narrower line widths and higher aspect ratios, improving cell conversion efficiency, reducing paste consumption, and lowering manufacturing costs.

Product Features
Field of application
Technical indicators

Product Features

Enables ultra-narrow line widths with 20%–50% paste savings

Adjustable aspect ratio from 10% to 80%, minimizing shading loss and boosting light-to-electricity conversion efficiency

High print consistency enhances electrical conductivity; compatible with low-temperature pastes

Non-contact, pressure-free printing significantly reduces breakage rate

Compatible with customized line patterns to maximize light reflection in lamination and increase module output

Supports a wide variety of advanced solar cell architectures

Designed for high-volume manufacturing with scalable output

Field of application

Applicable to HJT, TOPCon, XBC, PERC and other high-efficiency solar cell types

Technical indicators

Specification	Details
Compatible Wafer Sizes	Full, rectangular, or half-cut wafers (182 to 210 mm)
Compatible Wafer Thickness	100 to 180 μm
System Throughput	≥14,400 pcs/hour
Grid Line Width	10 to 15 μm
Grid Line Height	5 to 15 μm
Aspect Ratio	≥0.6
Production Mode	Supports both offline and inline operation, compatible with printing line integration